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HOME > Quality/Environment/Ethical Management > Quality requirements
Quality is our pride and survival base.
All employees shall adhere to the following guidelines to provide satisfiable products to customers.
(internal and external)
Interflex Co., Ltd
|No||Classification||System Name||Photo of System||Purpose||Features|
|1||Shape measuring machine||non-contact 3D surface shape measuring machine (Contour and Form Measuring System)||observe protruding or dented surface of sample materials and analyze unevenness etc. with 3D shape||able to measure the 3D surface shape up to 0.1mm~270㎛ with no contact at high precision and high speed|
|2||Element analysis||FT-IR MICROSCOPE||analyze properties of finished products and raw/subsidiary materials, analyze surface features, analyze combination structure||applied to be useful for samples with very low absorbance|
|3||High magnification observation & element analysis device||SEM-EDX Electron Microscope(Scanning Electron Microscope & Energy Dispersive X-Ray Micro Analyzer)||observe the illumination of product surface and analyze elements of sample materials by quantitative and qualitative reviews||Provide high emission current at low Kv, 3kV of image resolution in 7nm SE mode, and BSE mode image of 10nm in 7nm SE mode|
|4||Bending Test||Bending Test||Measure changes in resistance through flexibility test of FPCB cable products||flexibility measuring device optimized for cable products as on-demand device manufactured by customers’ request.|
|5||Binding post-tensioning force assessment||ACF (Anisotropic Conductive Film) / FOG Bonder||Anisotropic Conductive Film (ACF) is used for the assessment with the film adhered between glass and sample materials||can be commonly used for various types of boards by installing the guide to Glass Stage|
|6||Environment test equipment||Thermal Shock Tester||assess adhesion of plating by thermal shock of applying heat and quick freezing to the plating materials of oil state||save temperature moving time by the individual bathtub method for heating and cooling and enable various tests from -70℃~ 200℃.|
|7||Environment test equipment||Thermal Shock Tester||assess adhesion of plating by thermal shock of applying heating and quick freezing to the plating materials of gas state||quick return to the original temperature after turning the heating or cooling fan mode: in 5 minutes, precise temperature control: controllability ±0.2℃. Distribution ±2.0℃|
|8||Environment test equipment||Hot Oil Chamber Machine System||Assess heat resistance of laminating PCB products in oil state by coherence test||able to realize various tests by liquid state oil standing high temperature up to 250℃|
|9||Bending Test||Folding Endurance Tester||Assess the physical properties of materials by applying temperature and load to the circuit board materials||have the system additionally fitted with temperature control system to meet extreme test conditions (fitted for -40℃~150℃)|
|10||Bending Test||FPC Flexural Endurance Tester||Assess accelerated life to determine the degree of degradation caused by mechanical fatigue of the circuit board materials||realize right, left and vertical movement (600~3,000RPM/min), additional temperature control system (fitted for -40℃~150℃)|
|11||Environment test equipment||Low Temperature Tester||Assessment of products environment in low temperature state that can occur while storing or transporting PCB products||highly durable confined type compressor is fitted along with quick cooling function inside the chamber by the minimum contact high efficiency evaporator|
|12||Environment test equipment||Press Cooker Tester||Assessment of product features based on moisture absorption and infiltration by long-term exposing PCB products under high temperature and pressure||fitted with the bias test oriented function that certifies a certain amount of voltage or signal|
|13||Environment test equipment||Ion Migration Tester||Assessment of electro-insulation among each patter of high temperature and high moisture states of PCB products||a device that can perform all three tests of ion migration test, electro-insulation resistance measurement, and electro-insulation properties test at the same time|
|14||Assessment device of communication properties||Impedance measuring device||assessment of Impedance resistance change rate according to coupon design||base jitter of less than max. 450fs RMS/ fitted to measure TDR bandwidth and S-parameter|
|15||Assessment device of rebounding properties||SPRING BACK & STATIC BENDING TESTER||Assess the phenomenon of decreased bending due to resilience to get back to the original condition after being bent||suitable to adjust the angle up to 180˚ and the speed within the range of 5~30cpm|
|16||Measurement device of surface energy||Contact Angle Analyzer||Measure the measurable value of energy of water drops placed on the surface of PCB products||Setup the 3 phase modes of manual, semi-automation, and automation, and measure the volume of the motion control drop by syringe movement per 0.1㎕ with accuracy|
|17||Wire bonding||Bond Tester||Assess bonding tensile strength in the form of destruction or non-destruction for reliability test of semiconductor device||Be fitted with plugging relay that helps step back setup or control, establish and maintain the shear height with accuracy of up to 1㎛|
|18||Wire bonding||Wire Bonder||Assess tensile strength by Au Wire Bonding of PAD side of PCB products||Able to adjust the length of Au Wire and Roof Function per phase and able to measure in the mode of manual or automation|
|19||Environment test equipment||Temperature & Humidity Test Chamber||Assess moisture tolerance of products by maintaining the temperature or moisture within a certain range||Able to update the device as needed by the user and easy to clean as the condenser filter is readily detached or assembled on the left side of the chamber|
|20||Non-destructive testing device||CT X-RAY||Inspect a crack or openness if any by applying X rays in the state of non-destruction without destruction of PCB products|